RF and mm-Wave Systems and Circuits for Communications and Sensing

V. Vidojkovic1, D. Milosevic1, K. Ding1, R. van Dommele1, J. Holmstedt1, H. Lai1, C. van Puijenbroek1, R. Schalk1, V. Swaminathan1,2, R. Vissers1,3, Y. Hou1,
I . Zivkovic1, G. Radulov1, P. Baltus1

1Eindhoven University of Technology, Eindhoven, The Netherlands
2Tusk IC, Antwerp, Belgium
3Chalmers University of Technology, Gothenburg, Sweden



In the last decade wireless communications experienced exponential growth. Numbers of connected devices exceed the number of people on earth and the data rates can be as high as several GB/s. 5G communications already incorporate mm-wave frequencies. The next wave in wireless technology will be about sensing the environment and combining with communications. The applications are very versatile starting with driver monitoring, autonomous driving, industry applications related to non-destructive material testing, food control and improving efficiency in agriculture. The 6G standards will further extend the use of mm-wave bands for increasing data rates and for incorporating sensing functionality. From semiconductor technology and design perspective   a lot of progress has been made to gain speed, reliability and design flows that guarantee first-time right mm-wave circuits. The idea of this paper is to approach mm-wave communications and sensing from application, system, circuit perspective, identify challenges and finally show examples how to address them from circuit perspective.

Short Biography:

Vojkan Vidojkovic got MsC degree in 1999 from the University of Nis in Serbia. In 2007 he got PhD degree from the Eindhoven University of Technology in the Netherlands. In the period from 1999 to 2008 he was working in Mixed-signal Microelectronics group (MsM) at the Eindhoven University of Technology, Philips Research and Sitel Semiconductor in the Netherlands. From 2008 until 2013 he was with Imec in Belgium working as principal researcher. From august 2013 until January 2020 he was working as a member of technical staff/technical lead at Intel in Germany. From January 2020 he is working as associate professor in IC design group at Eindhoven University of Technology. Vojkan Vidojkovic has 23 years of experience in the field of RF integrated circuits/systems/architectures for wireless communications (2G, 3G, 4G, 5G, mm-wave). As recognition for scientific contribution to the solid state circuit community he served as TPC member of International Solid-State Circuit Conference (ISSCC) in 2015 and 2016. From 2020 Vojkan is a TPC member of European Solid-State Circuit Conference (ESSCIRC).